Constructed with a high-strength Polyethylene Terephthalate (PET) film that provides excellent dimensional stability and tensile strength (typically ≥100MPa.
Strong initial tack and leaves no residue upon removal
protecting TOPCon cells which are highly sensitive to moisture-induced degradation
Precision thickness (~0.065mm), allowing for a seamless fit.
withstand extreme lamination +180℃↑without shrinking, melting, or losing adhesive integrity
Vemould’s Solar Cell Tape (often referred to as Cell Positioning or Cell Fixing Tape) is an essential high-precision material used during the “lay-up” stage of solar module manufacturing.
Designed to hold solar cells and strings firmly in place, preventing displacement.
Features a balanced adhesive profile that provides immediate bonding to the glass or back-sheet
Engineered to be chemically inert during the melting of the EVA/POE encapsulant, ensuring no air bubbles.
Capable of withstanding lamination temperatures 180°C without losing structural integrity or adhesive
strength.
Engineered for high-accuracy printing in the solar and microelectronics industry.
Maintains uniform pressure and precise squeegee angle.
Hard-elastic carbon backing ensures stability and durability.
Delivers sharp prints at speeds of 250mm/sec with structures ≤ 50 μm.
Designed for reproducibility and efficiency in high-demand industries.
High-performance squeegees for PCB & solar cell printing, offering superior abrasion & ink resistance.
Bubble-free, homogenous material for sharp, precise prints.
High durability with excellent chemical and UV resistance.
Resistant to swelling, ensuring clean and consistent printing.
Anti-adhesive properties for quick and hassle-free cleaning.
A universal-grade polyurethane blade designed for reliable screen printing performance.
Ensures longevity in various applications.
Sharpens effortlessly for consistent precision.
Withstands diverse environmental conditions.
Color-coded for easy identification and handling.
Compared to aluminium alloys, composite bezels have excellent tensile and flexural strengths with full elastic recovery under stress. This eliminates permanent deformation and significantly reduces the risk of hidden wafer cracking over a 25-year product life cycle.
Tensile Strenth >1000MPa Bending Strength >1040MPa
Insulating volume resistivity of >1014Ω-m, does not require grounding, reduces cost.
Major defects as defined in IEC 61215-1 are not permitted, Qualified UV & Salt Spray test
High load resistance, 100% rebound after load release, especially suitable for high wind loads and high latitudes